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Freescale Semiconductor Technical Data
MPX4200A Rev 3, 07/2006
Integrated Silicon Pressure Sensor for Manifold Absolute Pressure Applications On-Chip Signal Conditioned, Temperature Compensated and Calibrated
The Freescale MPX4200A series Manifold Absolute Pressure (MAP) sensor for turbo boost engine control is designed to sense absolute air pressure within the intake manifold. This measurement can be used to compute the amount of fuel required for each cylinder. The MPX4200A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high level analog output signal and temperature compensation. The small form factor and reliability of on-chip integration make the Freescale MAP sensor a logical and economical choice for automotive system designers. Features * * * * * Specifically Designed for Intake Manifold Absolute Pressure Sensing in Engine Control Systems Patented Silicon Shear Stress Strain Gauge Temperature Compensated Over -40 to +125C Offers Reduction in Weight and Volume Compared to Existing Hybrid Modules Durable Epoxy Unibody Element
MPX4200A SERIES
INTEGRATED PRESSURE SENSOR 20 to 200 kPa (2.9 to 29 psi) 0.3 to 4.9 V OUTPUT
UNIBODY PACKAGE
MPX4200A CASE 867-08
Typical Applications * * * Manifold Sensing for Automotive Systems Ideally suited for Microprocessor or Microcontroller-Based Systems Also ideal for Non-Automotive Applications ORDERING INFORMATION
Device Type Options Case No. MPX Series Order No. MPX4200A Device Marking MPX4200A
PIN NUMBERS(1)
1 2 3 Vout GND VS 4 5 6 N/C N/C N/C
UNIBODY PACKAGE (MPX4200A SERIES) Basic Element Absolute, Element 867
1. Pins 4, 5, and 6 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead.
(c) Freescale Semiconductor, Inc., 2006. All rights reserved.
VS
Sensing Element
Thin Film Temperature Compensation and Gain Stage #1
Gain Stage #2 and Ground Reference Shift Circuitry
Vout
GND
Pins 4, 5, and 6 are NO CONNECTS for unibody devices.
Figure 1. Fully Integrated Pressure Sensor Schematic
Table 1. Maximum Ratings(1)
Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol PMAX TSTG TA Value 800 -40 to +125 -40 to +125 Unit kPa C C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPX4200A 2 Sensors Freescale Semiconductor
Table 2. Operating Characteristics (VS = 5.1 Vdc, TA = 25C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 3 required to meet electrical specifications.)
Characteristic Pressure Range(1) Supply Voltage(2) Supply Current Minimum Pressure Offset @ VS = 5.1 Volts(3) Full Scale Output @ VS = 5.1 Volts Full Scale Span @ VS = 5.1 Volts Accuracy(6) Sensitivity Response Time(7)
(4)
Symbol POP VS Io (0 to 85C) (0 to 85C) (0 to 85C) (0 to 85C) Voff VFSO VFSS -- V/P tR Io+ -- --
Min 20 4.85 -- 0.199 4.725 -- -- -- -- -- -- --
Typ -- 5.1 7.0 0.306 4.896 4.590 -- 25.5 1.0 0.1 20 0.5
Max 200 5.35 10 0.413 4.978 -- 1.5 -----------
Unit kPa Vdc mAdc Vdc Vdc Vdc %VFSS mV/kPa ms mAdc ms %VFSS
(5)
Output Source Current at Full Scale Output Warm-Up Time(8) Offset Stability
(9)
1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 5. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 6. Accuracy (error budget) consists of the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. * TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. * TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C. * Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25C. 7. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 8. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 9. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
Table 3. Mechanical Characteristics
Characteristics Weight, Basic Element (Case 867) Typ 4.0 Unit grams
MPX4200A Sensors Freescale Semiconductor 3
ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION
Silicone Die Coat Die P1 Wire Bond
Stainless Steel Metal Cover
Epoxy Case
Lead Frame P2 Sealed Vacuum Reference
RTV Die Bond
Figure 2. Cross Sectional Diagram (not to scale)
5.0 4.5 4.0 Vout Vs IPS 1.0 F 0.01 F GND 470 pF Output Output (Volts) 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 MIN MAX Transfer Function: Vout = Vs* (0.005 x P-0.04) Error VS = 5.1 Vdc Temperature = 0 to 85C
+5 V
TYP
Figure 3. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646) Figure 2 illustrates the absolute sensing chip in the basic chip carrier (Case 867). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The MPX4200A series pressure sensor operating characteristics, and internal reliability and qualification tests are based on use of dry air as the pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application.
Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over temperature range of 0 to 85C. The output will saturate outside of the specified pressure range.
MPX4200A 4 Sensors Freescale Semiconductor
0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200 210
Figure 4. Output versus Absolute Pressure
PACKAGE DIMENSIONS
C R M B -AN
PIN 1 SEATING PLANE
1 2 3 4 5 6
POSITIVE PRESSURE (P1)
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630).
INCHES MILLIMETERS MAX MIN MAX MIN 16.00 0.595 0.630 15.11 13.56 0.514 0.534 13.06 5.59 0.200 0.220 5.08 0.84 0.027 0.033 0.68 1.63 0.048 0.064 1.22 0.100 BSC 2.54 BSC 0.40 0.014 0.016 0.36 18.42 0.695 0.725 17.65 30 NOM 30 NOM 12.57 0.475 0.495 12.07 11.43 0.430 0.450 10.92 0.090 0.105 2.29 2.66
L
-TG F D 6 PL 0.136 (0.005)
M
J S
TA
M
DIM A B C D F G J L M N R S OPEN GROUND +VOUT +VSUPPLY -VOUT OPEN
STYLE 1: PIN 1. 2. 3. 4. 5. 6.
VOUT GROUND VCC V1 V2 VEX
STYLE 2: PIN 1. 2. 3. 4. 5. 6.
OPEN GROUND -VOUT VSUPPLY +VOUT OPEN
STYLE 3: PIN 1. 2. 3. 4. 5. 6.
CASE 867-08 ISSUE N UNIBODY PACKAGE
MPX4200A Sensors Freescale Semiconductor 5
How to Reach Us:
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MPX4200A Rev. 3 07/2006

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